Stress and Microstructure Evolution in Mo Thin Films Without or with Cover Layers During Thermal-Cycling

Stress and Microstructure Evolution in Mo Thin Films Without or with Cover Layers During Thermal-Cycling

The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO<sub>...

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Bibliographic Details
Main Authors: Eunmi Park, Marietta Seifert, Gayatri K. Rane, Siegfried B. Menzel, Thomas Gemming, Kornelius Nielsch
Format: Article
Language:English
Published: MDPI AG 2020-09-01
Series:Materials
Subjects:
molybdenum thin films
high-temperature behavior
intrinsic stress
Online Access:https://www.mdpi.com/1996-1944/13/18/3926

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