MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4-phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of hi...
Main Authors: | Jianming Guo, Hao Wang, Caixia Zhang, Qilong Zhang, Hui Yang |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-08-01
|
Series: | Polymers |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4360/12/9/1875 |
Similar Items
-
Fabrication of phthalonitrile-based copper-clad laminates and their application properties: Thermo-stability and dielectric properties
by: Mingzhen Xu, et al.
Published: (2020-10-01) -
PT/BORAX COMPOSITE AS A HIGH DIELECTRIC CONSTANT MATERIAL WITH LOWER DIELECTRIC LOSS
by: Mehmet Kılıç, et al.
Published: (2017-12-01) -
Dielectric loss of stretched polyethyleue terephthalate.
Published: (1974) -
Progress of heat resistant dielectric polymer nanocomposites with high dielectric constant
by: Ningning Zhu, et al.
Published: (2018-07-01) -
Achieving thermally conductive low loss PVDF-based dielectric composites via surface functionalization and orientation of SiC nanowires
by: B. Wang, et al.
Published: (2020-01-01)