Uniaxial tensile and shear deformation tests of gold–tin eutectic solder film

• Main Author: Takahiro Namazu, Hideki Takemoto, Hiroshi Fujita and Shozo Inoue
• Format: Article
• Language: English
• Published: Taylor & Francis Group 2007-01-01
• Series: Science and Technology of Advanced Materials
• Online Access: http://www.iop.org/EJ/abstract/1468-6996/8/3/A04
• ISSN: 1468-6996; 1878-5514

This paper describes a novel experimental technique for measuring mechanical properties of gold-tin (Au–Sn) eutectic solder film used for soldering package in microelectromechanical systems (MEMS). Dual-source DC magnetron sputtering was employed to deposit Au-20 weight % (wt%) Sn film. The tensile test with in situ X-ray diffraction (XRD) measurement evaluates the Young's modulus and Poisson's ratio at intermediate temperatures. The Young's modulus and Poisson's ratio at room temperature were found to be 51.3 GPa and 0.288, lower than bulk values. The Young's modulus decreased with increasing temperature, whereas the Poisson's ratio did not depend on temperature. The XRD tensile test also showed creep deformation behavior of Au–Sn film. We have developed a shear deformation test technique, which is performed by using Au–Sn film sandwiched by two single crystal silicon (Si) cantilever structures, to characterize the shear properties of the film. The shear moduli obtained from the shear deformation tests ranged from 11.5 to 13.3 GPa, about 38% lower than those from the XRD tensile tests. The measured shear strength from 12 to 17 MPa exhibited a temperature dependency. Information about the tensile and shear characteristics would likely to be of great use in designing Au–Sn soldering packages for MEMS.