Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition

Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition

Abstract The design of multifunctional alloys with multiple chemical components requires controllable synthesis approaches. Physical vapor deposition techniques, which result in thin films (<1 μm), have previously been demonstrated for micromechanical devices and metallic combinatorial libraries....

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Main Authors: Yijia Zhang, Patrick J. Shamberger
Format: Article
Language:English
Published: Nature Publishing Group 2018-08-01
Series:Scientific Reports
Online Access:https://doi.org/10.1038/s41598-018-29628-8
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spelling doaj-ca87db80447f4b9a889bd134f55928f52020-12-08T04:57:27ZengNature Publishing GroupScientific Reports2045-23222018-08-018111310.1038/s41598-018-29628-8Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical DepositionYijia Zhang0Patrick J. Shamberger1Department of Materials Science and Engineering, Texas A&M UniversityDepartment of Materials Science and Engineering, Texas A&M UniversityAbstract The design of multifunctional alloys with multiple chemical components requires controllable synthesis approaches. Physical vapor deposition techniques, which result in thin films (<1 μm), have previously been demonstrated for micromechanical devices and metallic combinatorial libraries. However, this approach deviates from bulk-like properties due to the residual stress derived in thin films and is limited by total film thickness. Here, we report a route to obtain ternary Ni-Mn-Sn alloy thick films with controllable compositions and thicknesses by annealing electrochemically deposited multi-layer monatomic (Ni, Mn, Sn) films, deposited sequentially from separate aqueous deposition baths. We demonstrate (1) controllable compositions, with high degree of uniformity, (2) smooth films, and (3) high reproducibility between film transformation behavior. Our results demonstrate a positive correlation between alloy film thicknesses and grain sizes, as well as consistent bulk-like transformation behavior.https://doi.org/10.1038/s41598-018-29628-8
collection DOAJ
language English
format Article
sources DOAJ
author Yijia Zhang
Patrick J. Shamberger
spellingShingle Yijia Zhang
Patrick J. Shamberger
Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
Scientific Reports
author_facet Yijia Zhang
Patrick J. Shamberger
author_sort Yijia Zhang
title Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_short Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_full Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_fullStr Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_full_unstemmed Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_sort thick film ni0.5mn0.5−xsnx heusler alloys by multi-layer electrochemical deposition
publisher Nature Publishing Group
series Scientific Reports
issn 2045-2322
publishDate 2018-08-01
description Abstract The design of multifunctional alloys with multiple chemical components requires controllable synthesis approaches. Physical vapor deposition techniques, which result in thin films (<1 μm), have previously been demonstrated for micromechanical devices and metallic combinatorial libraries. However, this approach deviates from bulk-like properties due to the residual stress derived in thin films and is limited by total film thickness. Here, we report a route to obtain ternary Ni-Mn-Sn alloy thick films with controllable compositions and thicknesses by annealing electrochemically deposited multi-layer monatomic (Ni, Mn, Sn) films, deposited sequentially from separate aqueous deposition baths. We demonstrate (1) controllable compositions, with high degree of uniformity, (2) smooth films, and (3) high reproducibility between film transformation behavior. Our results demonstrate a positive correlation between alloy film thicknesses and grain sizes, as well as consistent bulk-like transformation behavior.
url https://doi.org/10.1038/s41598-018-29628-8
work_keys_str_mv AT yijiazhang thickfilmni05mn05xsnxheusleralloysbymultilayerelectrochemicaldeposition
AT patrickjshamberger thickfilmni05mn05xsnxheusleralloysbymultilayerelectrochemicaldeposition
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