Cleaving of Extremely Porous Polymer Fibers
Different cleaving techniques, based on the use of a semiconductor dicing saw, focused-ion-beam milling, and a 193-nm ultraviolet laser, have been exploited to cleave highly porous polymer fibers developed for guiding terahertz radiation. Porous fibers made up of two different polymer materials have...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2009-01-01
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| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/5356213/ |