A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis
The Low Temperature Joining Technique (LTJT) using silver compounds enables to significantly increase the thermal conductivity between joined elements, which is much higher than for soldered joints. However, it also makes difficult to measure the thermal conductivity of the joint. The Laser Flash An...
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doaj-c6ac0bcf46374fce83e1e42664386fa32020-11-25T03:09:23ZengPolish Academy of SciencesMetrology and Measurement Systems2300-19412015-12-0122452153010.1515/mms-2015-0043mms-2015-0043A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash AnalysisSzałapak Jerzy0Kiełbasiński Konrad1Krzemiński Jakub2Młożniak Anna3Zwierkowska Elżbieta4Jakubowska Małgorzata5Pawłowski Radosław61) Warsaw University of Technology, Faculty of Mechatronics, Św. Andrzeja Boboli 8, 02-525 Warsaw, Poland2) Institute of Electronic Materials Technology, Wólczyńska 133, 01-919, Warsaw, Poland1) Warsaw University of Technology, Faculty of Mechatronics, Św. Andrzeja Boboli 8, 02-525 Warsaw, Poland2) Institute of Electronic Materials Technology, Wólczyńska 133, 01-919, Warsaw, Poland2) Institute of Electronic Materials Technology, Wólczyńska 133, 01-919, Warsaw, Poland1) Warsaw University of Technology, Faculty of Mechatronics, Św. Andrzeja Boboli 8, 02-525 Warsaw, Poland3) Abraxas, ul. Piaskowa 27, 44-300 Wodzisław Śląski, PolandThe Low Temperature Joining Technique (LTJT) using silver compounds enables to significantly increase the thermal conductivity between joined elements, which is much higher than for soldered joints. However, it also makes difficult to measure the thermal conductivity of the joint. The Laser Flash Analysis (LFA) is a non-intrusive method of measuring the temperature rise of one surface of a specimen after excitation with a laser pulse of its other surface. The main limitation of the LFA method is its standard computer software, which assumes the dimensions of a bonded component to be similar to those of the substrate, because it uses the standard Parker’s formula dedicated for one-dimensional heat flow. In the paper a special design of measured specimen was proposed, consisting of two copper plates of different size joined with the sintered silver layer. It was shown that heat properties of these specimens can also be measured after modifying the LFA method. The authors adapted these specimens by masking the false heat signal sourced from the uncovered plate area. Another adaptation was introducing a correcting factor of the heat travel distance, which was calculated with heat-flow simulations and placed into the Parker’s formula. The heat-flow simulated data were compared with the real LFA measurement results, which enabled estimation of the joint properties, e.g. its porosity.http://www.degruyter.com/view/j/mms.2015.22.issue-4/mms-2015-0043/mms-2015-0043.xml?format=INTthermal diffusivityLFALTJT jointshigh power electronics |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Szałapak Jerzy Kiełbasiński Konrad Krzemiński Jakub Młożniak Anna Zwierkowska Elżbieta Jakubowska Małgorzata Pawłowski Radosław |
spellingShingle |
Szałapak Jerzy Kiełbasiński Konrad Krzemiński Jakub Młożniak Anna Zwierkowska Elżbieta Jakubowska Małgorzata Pawłowski Radosław A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis Metrology and Measurement Systems thermal diffusivity LFA LTJT joints high power electronics |
author_facet |
Szałapak Jerzy Kiełbasiński Konrad Krzemiński Jakub Młożniak Anna Zwierkowska Elżbieta Jakubowska Małgorzata Pawłowski Radosław |
author_sort |
Szałapak Jerzy |
title |
A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis |
title_short |
A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis |
title_full |
A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis |
title_fullStr |
A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis |
title_full_unstemmed |
A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis |
title_sort |
method of calculating thermal diffusivity and conductivity for irregularly shaped specimens in laser flash analysis |
publisher |
Polish Academy of Sciences |
series |
Metrology and Measurement Systems |
issn |
2300-1941 |
publishDate |
2015-12-01 |
description |
The Low Temperature Joining Technique (LTJT) using silver compounds enables to significantly increase the thermal conductivity between joined elements, which is much higher than for soldered joints. However, it also makes difficult to measure the thermal conductivity of the joint. The Laser Flash Analysis (LFA) is a non-intrusive method of measuring the temperature rise of one surface of a specimen after excitation with a laser pulse of its other surface. The main limitation of the LFA method is its standard computer software, which assumes the dimensions of a bonded component to be similar to those of the substrate, because it uses the standard Parker’s formula dedicated for one-dimensional heat flow. In the paper a special design of measured specimen was proposed, consisting of two copper plates of different size joined with the sintered silver layer. It was shown that heat properties of these specimens can also be measured after modifying the LFA method. The authors adapted these specimens by masking the false heat signal sourced from the uncovered plate area. Another adaptation was introducing a correcting factor of the heat travel distance, which was calculated with heat-flow simulations and placed into the Parker’s formula. The heat-flow simulated data were compared with the real LFA measurement results, which enabled estimation of the joint properties, e.g. its porosity. |
topic |
thermal diffusivity LFA LTJT joints high power electronics |
url |
http://www.degruyter.com/view/j/mms.2015.22.issue-4/mms-2015-0043/mms-2015-0043.xml?format=INT |
work_keys_str_mv |
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