The effect of the size of NbTi filaments on interfacial reactions and the properties of InSn-based superconducting solder joints

• Main Authors: S. Santra, T. Davies, G. Matthews, J. Liu, C.R.M. Grovenor, S.C. Speller
• Format: Article
• Language: English
• Published: Elsevier 2019-08-01
• Series: Materials & Design
• Online Access: http://www.sciencedirect.com/science/article/pii/S0264127519302746

Interactions of superconducting Nb(47 wt% Ti) with liquid binary In-35 wt% Sn and Bi-containing ternary (In, 15 wt% Bi)-35 wt% Sn solders have been examined for the first time up to 450 °C. Reaction of NbTi with InSn results in an intermetallic phase, (Nb,Ti)Sn2, the morphology and chemical composition of which depends on the size of NbTi filaments. Larger filaments react to form a thin uniform (Nb,Ti)Sn2 phase with a Nb:Ti ratio of 6:1, while for finer filaments large (Nb,Ti)Sn2 grains grow with a Nb:Ti ratio of 0.5:1. Differences for interfacial phase layers have been explained by a diffusion-controlled growth model based on metallurgical state of NbTi filaments. Neither filamentary types exhibit any change in critical temperature (~9.2 K) after soldering treatment at 350 °C, but the irreversibility field and flux line pinning force of NbTi changes by a higher factor for the larger filaments. Interaction of NbTi with ternary (In,Bi)Sn results in a lack of any detectable interaction zone, and characteristic nucleation behaviour of phases in the bulk solder at NbTi–(In,Bi)Sn interface is rationalized on the basis of thermodynamic arguments. Transport measurements suggest that properties of solder are the limiting factor for joint behaviour and not any interfacial reactions. Keywords: Diffusion, Microstructure, Flux-pinning, Soldering, Texture