Validation of Forward Voltage Method to Estimate Cracks of the Solder Joints in High Power LED

• Main Authors: Federica Pinti, Alberto Belli, Lorenzo Palma, Massimo Gattari, Paola Pierleoni
• Format: Article
• Language: English
• Published: MDPI AG 2020-06-01
• Series: Electronics
• Subjects: LED; thermal cycling test; accelerated test; solder joint; cracks
• Online Access: https://www.mdpi.com/2079-9292/9/6/920

The Light Emitting Diode (LED) has many advantages compared to traditional lamps, such as a long lifetime, color rendering and energy saving. It requires good thermal management, since as the temperature increases, the lifetime decreases. Furthermore, the presence of cracks in the Solder Joint of an LED (SJL) compromises the correct dispersion of heat and causes the joint fatigue. This can lead to a decrease in the lifetime of the assembled LED. In this study, we validated that an SJL can be considered faulty if the Forward Voltage (Vf) acquired before and after thermal cycles increases by more than 2%. The voltage measurement method was validated by comparing the results with the techniques commonly used to evaluate the defects of a solder joint as the X-ray analysis and the metallographic section. The failure analysis results present the probability of failure and the lifetime of the SJL achieved by analyzing the data using the Norris–Landberg Model. The lifetime calculated over 1800 SJLs considered in the validation process is greater than 20 years for 95.9% of the tested LEDs.