| Summary: | In this study, we developed a rapid three-dimensional (3D) time-of-flight imaging tool for inspection of packaged semiconductor chips, using terahertz (THz) time-domain spectroscopy techniques. A high-speed THz system based on the optical sampling by cavity tuning technique is incorporated with a 2-axis galvano scanner to deliver a scanning speed of more than 100 Hz/pixel with a signal-to-noise ratio larger than 20 dB. Through the use of the Hilbert transformation, we reconstruct the 3D structure of the packaged chip in a nondestructive manner. Additionally, the use of frequency-selective imaging allows us to manipulate image resolution; the higher resolution was obtained when monitored using the higher frequency component. Further, using phase information, we were able to detect and identify defects in the packaged chip, such as the delamination area and epoxy-rich regions.
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