3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach

3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach

Micro-electronic devices are increasingly incorporating miniature multi-layered integrated architectures. However, the localization of faults in three-dimensional structure remains challenging. This study involved the experimental and numerical estimation of the depth of a thermally active heating s...

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Bibliographic Details
Main Authors: Ji Yong Bae, Kye-Sung Lee, Hwan Hur, Ki-Hwan Nam, Suk-Ju Hong, Ah-Yeong Lee, Ki Soo Chang, Geon-Hee Kim, Ghiseok Kim
Format: Article
Language:English
Published: MDPI AG 2017-10-01
Series:Sensors
Subjects:
infrared thermal microscopy
lock-in method
nondestructive test
finite element simulation
silicon wafer stacked heat source chip
Online Access:https://www.mdpi.com/1424-8220/17/10/2331

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