Ultra-flexible and robust transparent electrodes by embedding silver nanowires into polyimide matrix

• Main Authors: Rong Rong Zhao, Ming Shi Yu, Guan Cheng Wang, Wei Liu, Tong Lai Chen
• Format: Article
• Language: English
• Published: AIP Publishing LLC 2018-06-01
• Series: AIP Advances
• Online Access: http://dx.doi.org/10.1063/1.5026054

Silver nanowires (AgNWs) percolated films have been extensively considered as promising candidates for alternative transparent electrodes. However, due to their high surface roughness, poor adhesion and thermal stability, their practical use in transparent conducting film application is still heavily limited. In this paper, we report ultra-flexible transparent electrodes by imbedding AgNWs into polyimide (PI) thin films to achieve smooth surface, pronounced thermal stability, and high adhesion. Besides the excellent electrical conductivity of about 7-13Ω/□ in sheet resistance, the obtained AgNWs/PI films have excellent transparency and mechanical resilience due to the intrinsic physical and chemical properties of PI organic polymer. By embedding AgNWs into PI, the surface roughness of AgNWs percolated films can be reduced from 39.5 nm to 6 nm (RMS values), and the adhesion of AgNWs to PI is greatly enhanced if compared to the case of only AgNWs onto glass or plastic substrates. Additionally, the AgNWs/PI films show extraordinary stability in terms of electrical conductivity after the arbitrary twisting and thermal heating test, respectively, which are demonstrated by the electrical-thermal measurements via thermal IR imaging.