| Summary: | The process of curing of large thick composite parts needs attention regarding the formation of residual stresses. Similarly, novel reactive thermoplastics need investigating to produce an efficient thermal cure profile that decreases the risk of warpage and residual stress. In this work, the polymerization kinetics of the Elium resin system is investigated by differential scanning calorimetry (DSC) tests, the analysis of thermo-grams, and the parameters of Kamal and Sourour’s semi-empirical model. A numerical model based on finite elements was set up to reproduce the temperature fields during part consolidation. Several processing conditions were investigated (dwell temperature, environment, heat exchange) in order to predict the thermal gradient within the part. The optimal cure profile was identified as a function of process parameters with the aim of minimizing the thermal gradient within the composite element. The analysis revealed that, for the reactive thermoplastic Elium, the consolidation in facilities with high thermal exchange may increase the risk of residual stresses within the parts, erasing the advantage of short cure cycles.
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