Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection

Temperature-compensated damage monitoring in steel girder connections by using wireless acceleration-impedance sensor nodes is experimentally examined. To achieve the objective, the following approaches are implemented. Firstly, wireless acceleration-impedance sensor nodes are described on the desig...

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Main Authors: Dong-Soo Hong, Khac-Duy Nguyen, In-Cheol Lee, Jeong-Tae Kim
Format: Article
Language:English
Published: SAGE Publishing 2012-09-01
Series:International Journal of Distributed Sensor Networks
Online Access:https://doi.org/10.1155/2012/167120
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spelling doaj-be31aadfa6004bc6acddedce47ea25442020-11-25T03:38:22ZengSAGE PublishingInternational Journal of Distributed Sensor Networks1550-14772012-09-01810.1155/2012/167120Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder ConnectionDong-Soo HongKhac-Duy NguyenIn-Cheol LeeJeong-Tae KimTemperature-compensated damage monitoring in steel girder connections by using wireless acceleration-impedance sensor nodes is experimentally examined. To achieve the objective, the following approaches are implemented. Firstly, wireless acceleration-impedance sensor nodes are described on the design of hardware components to operate. Secondly, temperature-compensated damage monitoring scheme for steel girder connections is designed by using the temperature compensation model and acceleration-impedance-based structural health monitoring methods. Finally, the feasibility of temperature-compensated damage monitoring scheme by using wireless acceleration-impedance sensor nodes is experimentally evaluated from damage monitoring in a lab-scaled steel girder with bolted connection joints.https://doi.org/10.1155/2012/167120
collection DOAJ
language English
format Article
sources DOAJ
author Dong-Soo Hong
Khac-Duy Nguyen
In-Cheol Lee
Jeong-Tae Kim
spellingShingle Dong-Soo Hong
Khac-Duy Nguyen
In-Cheol Lee
Jeong-Tae Kim
Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection
International Journal of Distributed Sensor Networks
author_facet Dong-Soo Hong
Khac-Duy Nguyen
In-Cheol Lee
Jeong-Tae Kim
author_sort Dong-Soo Hong
title Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection
title_short Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection
title_full Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection
title_fullStr Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection
title_full_unstemmed Temperature-Compensated Damage Monitoring by Using Wireless Acceleration-Impedance Sensor Nodes in Steel Girder Connection
title_sort temperature-compensated damage monitoring by using wireless acceleration-impedance sensor nodes in steel girder connection
publisher SAGE Publishing
series International Journal of Distributed Sensor Networks
issn 1550-1477
publishDate 2012-09-01
description Temperature-compensated damage monitoring in steel girder connections by using wireless acceleration-impedance sensor nodes is experimentally examined. To achieve the objective, the following approaches are implemented. Firstly, wireless acceleration-impedance sensor nodes are described on the design of hardware components to operate. Secondly, temperature-compensated damage monitoring scheme for steel girder connections is designed by using the temperature compensation model and acceleration-impedance-based structural health monitoring methods. Finally, the feasibility of temperature-compensated damage monitoring scheme by using wireless acceleration-impedance sensor nodes is experimentally evaluated from damage monitoring in a lab-scaled steel girder with bolted connection joints.
url https://doi.org/10.1155/2012/167120
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