High Temperature, High Power Piezoelectric Composite Transducers

• Main Authors: Hyeong Jae Lee, Shujun Zhang, Yoseph Bar-Cohen, Stewart Sherrit
• Format: Article
• Language: English
• Published: MDPI AG 2014-08-01
• Series: Sensors
• Subjects: piezocomposites; high temperature; high power; transducer; sensor
• Online Access: http://www.mdpi.com/1424-8220/14/8/14526

Piezoelectric composites are a class of functional materials consisting of piezoelectric active materials and non-piezoelectric passive polymers, mechanically attached together to form different connectivities. These composites have several advantages compared to conventional piezoelectric ceramics and polymers, including improved electromechanical properties, mechanical flexibility and the ability to tailor properties by using several different connectivity patterns. These advantages have led to the improvement of overall transducer performance, such as transducer sensitivity and bandwidth, resulting in rapid implementation of piezoelectric composites in medical imaging ultrasounds and other acoustic transducers. Recently, new piezoelectric composite transducers have been developed with optimized composite components that have improved thermal stability and mechanical quality factors, making them promising candidates for high temperature, high power transducer applications, such as therapeutic ultrasound, high power ultrasonic wirebonding, high temperature non-destructive testing, and downhole energy harvesting. This paper will present recent developments of piezoelectric composite technology for high temperature and high power applications. The concerns and limitations of using piezoelectric composites will also be discussed, and the expected future research directions will be outlined.