Transient Numerical Modelling of the Pin-in-Paste Technology

Transient Numerical Modelling of the Pin-in-Paste Technology

The pin-in-paste technology is an advancing soldering technology for assembling complex electronic products, which include both surface-mounted and through-hole components. A computational fluid dynamics model was established to investigate the stencil printing step of this technology, where the hol...

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Bibliographic Details
Main Authors:	Tareq Ibrahim Al-Ma'aiteh, Oliver Krammer, Balázs Illés
Format:	Article
Language:	English
Published:	MDPI AG 2021-05-01
Series:	Applied Sciences
Subjects:	pin-in-paste technology fluid dynamics non-Newtonian fluid properties transient numerical modelling through-hole shape reflow soldering
Online Access:	https://www.mdpi.com/2076-3417/11/10/4670

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