Process Condition Diagram Predicting Onset of Microdefects and Fracture in Cold Bar Drawing

• Main Authors: Yong-Hoon Roh, Donghyuk Cho, Hae-Chang Choi, Zhaorui Yang, Youngseog Lee
• Format: Article
• Language: English
• Published: MDPI AG 2021-03-01
• Series: Metals
• Subjects: process condition diagram; drawing test; microvoid; microcracks; cumulative damage; SEM
• Online Access: https://www.mdpi.com/2075-4701/11/3/479

This paper presents a process condition diagram (PCD) that not only identifies conditions under which materials fracture during bar drawing, but also infers the presence or absence of microdefects such as microvoids and microcracks in the drawn material as accumulative damage changes owing to the die semi-angle and reduction ratio. The accumulative damage values were calculated by finite element (FE) analysis. The critical damage values were determined by performing a tensile test using a smooth round bar tensile specimen and performing FE analysis simulating the tensile test. High alloy steel with a 13 mm diameter was used for the draw bench testing in a wide range of drawing conditions. Scanning electron microscopy (SEM) analysis was performed to verify the usefulness of the PCD. SEM images showed that the accumulative damage roughly matched the size of microvoids around the non-metallic inclusions and the creation of microcracks, which eventually led to fractures of material being drawn. Hence, utilizing the proposed PCD, a process designer can design drawing conditions that minimize the occurrence of microdefects in the material being drawn while maximizing the reduction ratio.