Microstructure Evolution of Sn-35Bi-1Ag/Ni-P/Cu Solder Joints During Post-reflow Cooling and Isothermal Aging
Two kinds of rapid and slow cooling solder joints of Sn-35Bi-1Ag/Ni-P/Cu were prepared by reflow soldering and then cooling in water and oven, respectively. The kinetics of two kinds of layers were investigated using isothermal aging. Scanning electron microscope and energy dispersive spectrum were...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Journal of Materials Engineering
2018-06-01
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| Series: | Journal of Materials Engineering |
| Subjects: | |
| Online Access: | http://jme.biam.ac.cn/CN/Y2018/V46/I6/95 |