Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify...
Main Authors: | Dong Yang, Xumeng Zhang, Jianguo Zhu |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-03-01
|
Series: | Surfaces |
Subjects: | |
Online Access: | https://www.mdpi.com/2571-9637/4/1/11 |
Similar Items
Similar Items
-
Deposition of Nanostructured CdS Thin Films by Thermal Evaporation Method: Effect of Substrate Temperature
by: Nafiseh Memarian, et al.
Published: (2017-07-01) -
Investigation of the dimensional stability of an ultra-thin film gas/liquid contactor
by: Peterson, Jerrod P.
Published: (2012) -
Thermoelectric and structural characterization of individual nanowires and patterned thin films
by: Mavrokefalos, Anastassios Andreas
Published: (2013) -
CHARACTERISTICS OF 2-2 POLYIMIDE/PZT COMPOSITE FILMS ON Pt/Si SUBSTRATE
by: PHATAK, DEEPTI DILIP
Published: (2002) -
Atomic Layer Deposition of Superconducting CuO Thin Films on Three-Dimensional Substrates
by: Aile Tamm, et al.
Published: (2020-07-01)