Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures

Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify...

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Main Authors: Dong Yang, Xumeng Zhang, Jianguo Zhu
Format: Article
Language:English
Published: MDPI AG 2021-03-01
Series:Surfaces
Subjects:
Online Access:https://www.mdpi.com/2571-9637/4/1/11
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spelling doaj-b4f30cd8105a4ea29ee72bfc388996282021-03-20T00:07:50ZengMDPI AGSurfaces2571-96372021-03-01411899610.3390/surfaces4010011Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate StructuresDong Yang0Xumeng Zhang1Jianguo Zhu2Faculty of Civil Engineering and Mechanics, Jiangsu University, Zhenjiang 212013, ChinaFaculty of Civil Engineering and Mechanics, Jiangsu University, Zhenjiang 212013, ChinaFaculty of Civil Engineering and Mechanics, Jiangsu University, Zhenjiang 212013, ChinaResidual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify the proposed method. The full fields of nonuniform thin-film stresses are obtained in a room temperature to high-temperature environment of 200 °C, which can be potentially extended to higher temperatures. These results provide a fundamental approach to understanding thin-film stresses and a feasible measurement method for high temperature.https://www.mdpi.com/2571-9637/4/1/11thin filmcurvature measurementstressdigital image correlation method
collection DOAJ
language English
format Article
sources DOAJ
author Dong Yang
Xumeng Zhang
Jianguo Zhu
spellingShingle Dong Yang
Xumeng Zhang
Jianguo Zhu
Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
Surfaces
thin film
curvature measurement
stress
digital image correlation method
author_facet Dong Yang
Xumeng Zhang
Jianguo Zhu
author_sort Dong Yang
title Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
title_short Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
title_full Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
title_fullStr Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
title_full_unstemmed Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
title_sort noncontact and full-field measurement of residual and thermal stress in film/substrate structures
publisher MDPI AG
series Surfaces
issn 2571-9637
publishDate 2021-03-01
description Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify the proposed method. The full fields of nonuniform thin-film stresses are obtained in a room temperature to high-temperature environment of 200 °C, which can be potentially extended to higher temperatures. These results provide a fundamental approach to understanding thin-film stresses and a feasible measurement method for high temperature.
topic thin film
curvature measurement
stress
digital image correlation method
url https://www.mdpi.com/2571-9637/4/1/11
work_keys_str_mv AT dongyang noncontactandfullfieldmeasurementofresidualandthermalstressinfilmsubstratestructures
AT xumengzhang noncontactandfullfieldmeasurementofresidualandthermalstressinfilmsubstratestructures
AT jianguozhu noncontactandfullfieldmeasurementofresidualandthermalstressinfilmsubstratestructures
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