Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify...
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doaj-b4f30cd8105a4ea29ee72bfc388996282021-03-20T00:07:50ZengMDPI AGSurfaces2571-96372021-03-01411899610.3390/surfaces4010011Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate StructuresDong Yang0Xumeng Zhang1Jianguo Zhu2Faculty of Civil Engineering and Mechanics, Jiangsu University, Zhenjiang 212013, ChinaFaculty of Civil Engineering and Mechanics, Jiangsu University, Zhenjiang 212013, ChinaFaculty of Civil Engineering and Mechanics, Jiangsu University, Zhenjiang 212013, ChinaResidual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify the proposed method. The full fields of nonuniform thin-film stresses are obtained in a room temperature to high-temperature environment of 200 °C, which can be potentially extended to higher temperatures. These results provide a fundamental approach to understanding thin-film stresses and a feasible measurement method for high temperature.https://www.mdpi.com/2571-9637/4/1/11thin filmcurvature measurementstressdigital image correlation method |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Dong Yang Xumeng Zhang Jianguo Zhu |
spellingShingle |
Dong Yang Xumeng Zhang Jianguo Zhu Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures Surfaces thin film curvature measurement stress digital image correlation method |
author_facet |
Dong Yang Xumeng Zhang Jianguo Zhu |
author_sort |
Dong Yang |
title |
Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures |
title_short |
Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures |
title_full |
Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures |
title_fullStr |
Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures |
title_full_unstemmed |
Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures |
title_sort |
noncontact and full-field measurement of residual and thermal stress in film/substrate structures |
publisher |
MDPI AG |
series |
Surfaces |
issn |
2571-9637 |
publishDate |
2021-03-01 |
description |
Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify the proposed method. The full fields of nonuniform thin-film stresses are obtained in a room temperature to high-temperature environment of 200 °C, which can be potentially extended to higher temperatures. These results provide a fundamental approach to understanding thin-film stresses and a feasible measurement method for high temperature. |
topic |
thin film curvature measurement stress digital image correlation method |
url |
https://www.mdpi.com/2571-9637/4/1/11 |
work_keys_str_mv |
AT dongyang noncontactandfullfieldmeasurementofresidualandthermalstressinfilmsubstratestructures AT xumengzhang noncontactandfullfieldmeasurementofresidualandthermalstressinfilmsubstratestructures AT jianguozhu noncontactandfullfieldmeasurementofresidualandthermalstressinfilmsubstratestructures |
_version_ |
1724212382332354560 |