Noncontact and Full-Field Measurement of Residual and Thermal Stress in Film/Substrate Structures
Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-03-01
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| Series: | Surfaces |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2571-9637/4/1/11 |
| Summary: | Residual stress and thermal stress of a film/substrate system are determined based on the curvature measurement with a 3D digital image correlation method (DIC) and calculation of the thin-film stresses by the extension of Stoney’s formula. A Ni film electroplated on a H62Cu plate is used to verify the proposed method. The full fields of nonuniform thin-film stresses are obtained in a room temperature to high-temperature environment of 200 °C, which can be potentially extended to higher temperatures. These results provide a fundamental approach to understanding thin-film stresses and a feasible measurement method for high temperature. |
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| ISSN: | 2571-9637 |