Study on the Spreading Characteristics of the Solder Sn-3.0Ag-0.5Cu on an Inverted V-shaped Substrate
The impact of the contact angle of a droplet, the included angle of a substrate and the droplet volume on the morphology and profile of the droplet is discussed, and the spreading characteristics of lead-free solder on an inverted V-shaped substrate are studied, which provides theoretical guidance a...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2020-01-01
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| Series: | E3S Web of Conferences |
| Online Access: | https://www.e3s-conferences.org/articles/e3sconf/pdf/2020/05/e3sconf_iaecst2020_02069.pdf |