Study on the Spreading Characteristics of the Solder Sn-3.0Ag-0.5Cu on an Inverted V-shaped Substrate

• Main Authors: Yang Xiaolin, Xu Bingsheng, Hou Shan, Liu Ren, Zhao Xuezhi
• Format: Article
• Language: English
• Published: EDP Sciences 2020-01-01
• Series: E3S Web of Conferences
• Online Access: https://www.e3s-conferences.org/articles/e3sconf/pdf/2020/05/e3sconf_iaecst2020_02069.pdf

The impact of the contact angle of a droplet, the included angle of a substrate and the droplet volume on the morphology and profile of the droplet is discussed, and the spreading characteristics of lead-free solder on an inverted V-shaped substrate are studied, which provides theoretical guidance and data support for a comprehensive study of the interface reaction and wetting mechanism between solder and substrate, and helps improve the brazing process to adapt to complex welding operations. Based on the method of finite element simulation, different contact angles, included angles of inverted V-shaped substrate, droplet volumes and other variables are entered in the model; the relevant physical parameters are defined according to the surface tension and density of solder Sn-3.0Ag-0.5Cu at temperature of 490K; the theoretical spreading results of the droplet are simulated and calculated by Surface Evolver by using the principle of energy minimization and the method of gradient descent; and the spreading distance, contact area and energy equivalence of the droplet are read out by program, which helps to investigate the spreading behavior and wetting characteristics of the droplet.