Research on Contact State and Its Effect on Forming Precision in Uniform-Contact Stretch Forming Based on Loading at Multi-Position

• Main Authors: Lirong Sun, Zhongyi Cai, Xiangji Li
• Format: Article
• Language: English
• Published: MDPI AG 2019-06-01
• Series: Metals
• Subjects: uniform contact; forming precision; stretch forming; discrete clamps; sheet metal
• Online Access: https://www.mdpi.com/2075-4701/9/7/719

Uniform-contact stretch forming based on loading at multi-position (UC-SF) was designed to substitute for conventional stretch forming (C-SF) in the manufacturing of qualified three-dimensional surface parts of a specified shape. Since the integral rigid clamps are replaced by discrete clamps, the sheet metal can be bent in a transverse direction (perpendicular to the stretching direction), and the sheet metal can be automatically warped to the die surface during the loading process. In this paper, finite element numerical simulations were performed to research the contact state evolution and its effect on forming precision by two kinds of loading modes (UC-SF and C-SF). The evolutions of contact state for spherical and saddle-shaped parts were analyzed in different steps, and the results reflect that, in UC-SF, the contact region of curved surface parts is gradually extended in a long strip, and the effective formed regions of the final parts can be in contact with the die surface. However, in C-SF, it is difficult for the final parts to be completely in contact with the die surface, especially spherical parts of a large curvature. Moreover, it is found that the noncontact region of the saddle-shaped part is susceptible to wrinkling in C-SF. Conversely, in UC-SF, the sheet metal can be constrained by contact with a die surface, such that the noncontact region and wrinkle defect disappear and high-precision parts are formed. Finally, stretch forming experiments were carried out and the perfect curved surface part was formed; thus, the experimental results verify the feasibility and effectiveness of UC-SF.