High temperature superplasticity and its deformation mechanism of AA6063/SiCp

• Main Authors: Vijayananth S, Jayaseelan V, Ajith Arul Daniel S, Nallapaneni Manoj Kumar
• Format: Article
• Language: English
• Published: Elsevier 2019-09-01
• Series: Case Studies in Thermal Engineering
• Online Access: http://www.sciencedirect.com/science/article/pii/S2214157X19300966

Superplastic forming is primarily used for thin-walled and complex shape structures. This process is much successful in industries mainly for the fabrication of intricate components used for aerospace and automobile industries. In this paper, superplastic forming behavior and microstructural evolution in Al/5%SiCp composites were studied at different temperatures through the hot tensile test. In a hot tensile test, a maximum elongation (i.e., 227%) was obtained at the 580 °C temperature condition. When the temperature was more than 580 °C, the elongation was reduced to less than 100%. Similarly, when the temperature is adjusted to a value lesser than 550 °C, the reduction in the elongation is seen which is less than 100%. Here, the microstructure study of the test samples is studied through the optical microscope. From the microstructure analysis, the grain refinement is taken place by dynamic re-crystallization and the intergranular deformation with grain boundary sliding is observed. It is understood that, the dynamic re-crystallization and grain boundary sliding increases the percentage of elongation and on the other hand the ductility reduces due to the presence of excessive liquid phase at the grain boundaries. Keywords: Superplastic forming, Al/SiCp composites, Tensile test, Microstructure analysis, Aluminum alloy, AA6063/SiCp