An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produc...

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Main Authors: Saud Norainiza, Mohd Said Rita, Mohd Salleh Mohd Arif Anuar, Derman Mohd Nazree, Ramli Mohd Izrul Izwan, Mohd Nasir Norhayanti
Format: Article
Language:English
Published: EDP Sciences 2016-01-01
Series:MATEC Web of Conferences
Online Access:http://dx.doi.org/10.1051/matecconf/20167801070
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spelling doaj-add98c42fe70400db11302529fc2158c2021-02-02T02:05:23ZengEDP SciencesMATEC Web of Conferences2261-236X2016-01-01780107010.1051/matecconf/20167801070matecconf_icongdm2016_01070An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste CompositeSaud Norainiza0Mohd Said Rita1Mohd Salleh Mohd Arif Anuar2Derman Mohd Nazree3Ramli Mohd Izrul Izwan4Mohd Nasir Norhayanti5Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further.http://dx.doi.org/10.1051/matecconf/20167801070
collection DOAJ
language English
format Article
sources DOAJ
author Saud Norainiza
Mohd Said Rita
Mohd Salleh Mohd Arif Anuar
Derman Mohd Nazree
Ramli Mohd Izrul Izwan
Mohd Nasir Norhayanti
spellingShingle Saud Norainiza
Mohd Said Rita
Mohd Salleh Mohd Arif Anuar
Derman Mohd Nazree
Ramli Mohd Izrul Izwan
Mohd Nasir Norhayanti
An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
MATEC Web of Conferences
author_facet Saud Norainiza
Mohd Said Rita
Mohd Salleh Mohd Arif Anuar
Derman Mohd Nazree
Ramli Mohd Izrul Izwan
Mohd Nasir Norhayanti
author_sort Saud Norainiza
title An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
title_short An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
title_full An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
title_fullStr An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
title_full_unstemmed An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
title_sort investigation of tio2 addition on microstructure evolution of sn-cu-ni solder paste composite
publisher EDP Sciences
series MATEC Web of Conferences
issn 2261-236X
publishDate 2016-01-01
description In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further.
url http://dx.doi.org/10.1051/matecconf/20167801070
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