Analysis of a trilayer thermal cloak

An analytical solution exists for a circular bilayer cloak against a background of linearly varying temperature distribution and under steady state. In particular, the ratio of the outer-layer and background conductivity is fixed, given the inner and outer radius of the outer layer. This conductivit...

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Main Authors: Woon-Shing Yeung, Fu-Yao Yang, Ruey-Jen Yang
Format: Article
Language:English
Published: AIP Publishing LLC 2020-05-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/5.0005920
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spelling doaj-ac4c5cac772d436a9c056d17ab9451c32020-11-25T02:39:17ZengAIP Publishing LLCAIP Advances2158-32262020-05-01105055102055102-510.1063/5.0005920Analysis of a trilayer thermal cloakWoon-Shing Yeung0Fu-Yao Yang1Ruey-Jen Yang2Department of Engineering Science, National Cheng Kung University, Tainan, TaiwanDepartment of Engineering Science, National Cheng Kung University, Tainan, TaiwanDepartment of Engineering Science, National Cheng Kung University, Tainan, TaiwanAn analytical solution exists for a circular bilayer cloak against a background of linearly varying temperature distribution and under steady state. In particular, the ratio of the outer-layer and background conductivity is fixed, given the inner and outer radius of the outer layer. This conductivity ratio could be large, thus limiting the selection of bulk materials for the outer layer. This study reports a different design by adding a third layer of known conductivity between the inner and the outer layer of the bilayer cloak. The analysis extends the analytical solution of the bilayer cloak. For the same outer layer geometry between the bilayer and trilayer cloak, the proposed trilayer design gives a less limiting conductivity ratio between the outer layer and the background material than the bilayer design. Consequently, the trilayer design can enhance the selection of natural materials for the outer layer of the thermal cloak.http://dx.doi.org/10.1063/5.0005920
collection DOAJ
language English
format Article
sources DOAJ
author Woon-Shing Yeung
Fu-Yao Yang
Ruey-Jen Yang
spellingShingle Woon-Shing Yeung
Fu-Yao Yang
Ruey-Jen Yang
Analysis of a trilayer thermal cloak
AIP Advances
author_facet Woon-Shing Yeung
Fu-Yao Yang
Ruey-Jen Yang
author_sort Woon-Shing Yeung
title Analysis of a trilayer thermal cloak
title_short Analysis of a trilayer thermal cloak
title_full Analysis of a trilayer thermal cloak
title_fullStr Analysis of a trilayer thermal cloak
title_full_unstemmed Analysis of a trilayer thermal cloak
title_sort analysis of a trilayer thermal cloak
publisher AIP Publishing LLC
series AIP Advances
issn 2158-3226
publishDate 2020-05-01
description An analytical solution exists for a circular bilayer cloak against a background of linearly varying temperature distribution and under steady state. In particular, the ratio of the outer-layer and background conductivity is fixed, given the inner and outer radius of the outer layer. This conductivity ratio could be large, thus limiting the selection of bulk materials for the outer layer. This study reports a different design by adding a third layer of known conductivity between the inner and the outer layer of the bilayer cloak. The analysis extends the analytical solution of the bilayer cloak. For the same outer layer geometry between the bilayer and trilayer cloak, the proposed trilayer design gives a less limiting conductivity ratio between the outer layer and the background material than the bilayer design. Consequently, the trilayer design can enhance the selection of natural materials for the outer layer of the thermal cloak.
url http://dx.doi.org/10.1063/5.0005920
work_keys_str_mv AT woonshingyeung analysisofatrilayerthermalcloak
AT fuyaoyang analysisofatrilayerthermalcloak
AT rueyjenyang analysisofatrilayerthermalcloak
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