In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures

In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures

In situ nanoindentation experiments have been widely adopted to characterize material behaviors of microelectronic devices. This work introduces the latest developments of nanoindentation experiments in the characterization of nonlinear material properties of 3D integrated microelectronic devices us...

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Bibliographic Details
Main Authors: Chenglin Wu, Congjie Wei, Yanxiao Li
Format: Article
Language:English
Published: MDPI AG 2019-01-01
Series:Micromachines
Subjects:
TSV
nanoindentation
FIB
micro-cantilever beam
mixed-mode
fracture
Online Access:https://www.mdpi.com/2072-666X/10/2/86

Internet

https://www.mdpi.com/2072-666X/10/2/86

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