Heat and mass transfer for a small diameter thermosyphon with low fill ratio

Thermosyphons of smaller dimensions are more commonly sought after as electronics cooling devices. The interactions of the tube wall and working fluid become more significant as the dimension of a thermosyphon is reduced, particularly for high surface tension fluids such as water. This paper aims to...

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Bibliographic Details
Main Authors: Anthony J. Robinson, Kate Smith, Turlough Hughes, Sauro Filippeschi
Format: Article
Language:English
Published: Elsevier 2020-02-01
Series:International Journal of Thermofluids
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2666202719300102
Description
Summary:Thermosyphons of smaller dimensions are more commonly sought after as electronics cooling devices. The interactions of the tube wall and working fluid become more significant as the dimension of a thermosyphon is reduced, particularly for high surface tension fluids such as water. This paper aims to experimentally investigate a water-charged, small diameter (8 mm) thermosyphon as it operates with a low (25%) filling ratio for a relatively long evaporator length of 200 mm. High speed videography provides in-situ flow pattern visualization at different heat input power. The boiling regimes for each level of heat flux are determined by analyzing the flow patterns from the high-speed video footage. The interdependence of the flow regimes and the heat and mass transfer mechanisms is evaluated using the measured wall temperature variations and derived thermosyphon performance metrics, such as the average heat transfer coefficients and thermal resistances. It was observed that the heat and mass transport was dominated by Geyser-type boiling at lower heat fluxes with associated low heat transfer coefficients in the evaporator and condenser. With increasing thermal power, less liquid was observed to return to the evaporator resulting in more aggressive boiling events which improved the heat transfer coefficients in both the evaporator and condenser. For all power levels tested, the dominant thermal resistance was found to be that associated with the condenser. The ultimate failure of the thermosyphon was a result of liquid hold-up in the condenser section and subsequent falling liquid film and evaporator dryout.
ISSN:2666-2027