Structural Design of Three-Dimensional Graphene/Nano Filler (Al<sub>2</sub>O<sub>3</sub>, BN, or TiO<sub>2</sub>) Resins and Their Application to Electrically Conductive Adhesives

In this study, we designed a three-dimensional structure of electrically conductive adhesives (ECAs) by adding three different kinds of nano filler, including BN, TiO<sub>2</sub>, and Al<sub>2</sub>O<sub>3</sub> particles, into a few-layered graphene (FLG)/polymer...

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Bibliographic Details
Main Authors: Chia-Hsin Zhang, Chia-Hung Huang, Wei-Ren Liu
Format: Article
Language:English
Published: MDPI AG 2019-10-01
Series:Polymers
Subjects:
bn
Online Access:https://www.mdpi.com/2073-4360/11/10/1713