The effect of PECVD plasma decomposition on the wettability and dielectric constant changes in silicon modified DLC films for potential MEMS and low stiction applications

The effect of PECVD plasma decomposition on the wettability and dielectric constant changes in silicon modified DLC films for potential MEMS and low stiction applications

We have carried out investigations aimed at understanding the mechanism responsible for a water contact angle increase of up to ten degrees and a decrease in dielectric constant in silicon modified hydrogenated amorphous carbon films compared to unmodified hydrogenated amorphous carbon films. Our in...

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Bibliographic Details
Main Authors: A. A. Ogwu, T. I. T. Okpalugo, J. A. D. McLaughlin
Format: Article
Language:English
Published: AIP Publishing LLC 2012-09-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.4742852

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