High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor deposition

The dielectric integrity has been one of the major obstacle in bringing out capacitor devices with suitable performance characteristics at high temperatures. In this paper, BxNyOz dielectric films for high temperature capacitors solutions are investigated. The films were grown on silicon substrate b...

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Main Author: N. Badi
Format: Article
Language:English
Published: World Scientific Publishing 2015-12-01
Series:Journal of Advanced Dielectrics
Subjects:
Online Access:http://www.worldscientific.com/doi/pdf/10.1142/S2010135X15500290
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spelling doaj-a5d62ee3051f40b9b2ef031d783fcd092020-11-25T00:16:48ZengWorld Scientific PublishingJournal of Advanced Dielectrics2010-135X2010-13682015-12-01541550029-11550029-510.1142/S2010135X1550029010.1142/S2010135X15500290High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor depositionN. Badi0Center for Advanced Materials, University of Houston, Houston, Texas 77204-5004, USAThe dielectric integrity has been one of the major obstacle in bringing out capacitor devices with suitable performance characteristics at high temperatures. In this paper, BxNyOz dielectric films for high temperature capacitors solutions are investigated. The films were grown on silicon substrate by using ion source assisted physical vapor deposition technique. The as-grown films were characterized by SEM, XRD, and XPS. The capacitor structures were fabricated using BxNyOz as a dielectric and titanium as metal electrodes. The elaborated devices were subjected to electrical and thermal characterization. They exhibited low electrical loss and very good stability when subjected to high temperature for a prolonged period of time.http://www.worldscientific.com/doi/pdf/10.1142/S2010135X15500290Boron oxynitridedielectrichigh temperature capacitor
collection DOAJ
language English
format Article
sources DOAJ
author N. Badi
spellingShingle N. Badi
High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor deposition
Journal of Advanced Dielectrics
Boron oxynitride
dielectric
high temperature capacitor
author_facet N. Badi
author_sort N. Badi
title High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor deposition
title_short High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor deposition
title_full High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor deposition
title_fullStr High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor deposition
title_full_unstemmed High temperature dielectric properties of (BxNyOz) thin films deposited using ion source assisted physical vapor deposition
title_sort high temperature dielectric properties of (bxnyoz) thin films deposited using ion source assisted physical vapor deposition
publisher World Scientific Publishing
series Journal of Advanced Dielectrics
issn 2010-135X
2010-1368
publishDate 2015-12-01
description The dielectric integrity has been one of the major obstacle in bringing out capacitor devices with suitable performance characteristics at high temperatures. In this paper, BxNyOz dielectric films for high temperature capacitors solutions are investigated. The films were grown on silicon substrate by using ion source assisted physical vapor deposition technique. The as-grown films were characterized by SEM, XRD, and XPS. The capacitor structures were fabricated using BxNyOz as a dielectric and titanium as metal electrodes. The elaborated devices were subjected to electrical and thermal characterization. They exhibited low electrical loss and very good stability when subjected to high temperature for a prolonged period of time.
topic Boron oxynitride
dielectric
high temperature capacitor
url http://www.worldscientific.com/doi/pdf/10.1142/S2010135X15500290
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