The microstructure and mechanical properties of copper in electrically assisted tension
This study focuses on the mechanical behavior and microstructure evolution of oxygen-free high conductivity copper in the presence of electropulse. The result shows the tensile strength and strain-to-failure decrease linearly with the increase of pulse frequency, and the fracture mode changes from d...
Main Authors: | Jing He, Zhi Zeng, Huabing Li, Shuai Wang |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2020-11-01
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Series: | Materials & Design |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127520307061 |
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