Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass

The paper gives overview of the results of using narrow-aperture electron beam generated by a forevacuum plasma electron source as a tool for treatment of electrically non-conductive materials, such as technical glass. Effectiveness of electron beam treatment of non-conductive materials is caused by...

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Main Authors: Zenin Aleksey, Klimov Aleksandr, Bakeev Ilya
Format: Article
Language:English
Published: EDP Sciences 2018-01-01
Series:MATEC Web of Conferences
Online Access:https://doi.org/10.1051/matecconf/201814303006
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spelling doaj-a1316547e7894548b12cf802e4709c982021-02-02T00:50:25ZengEDP SciencesMATEC Web of Conferences2261-236X2018-01-011430300610.1051/matecconf/201814303006matecconf_yssip2017_03006Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glassZenin AlekseyKlimov AleksandrBakeev IlyaThe paper gives overview of the results of using narrow-aperture electron beam generated by a forevacuum plasma electron source as a tool for treatment of electrically non-conductive materials, such as technical glass. Effectiveness of electron beam treatment of non-conductive materials is caused by almost complete neutralization of target charge on the treated surface. Charge neutralization occurs due to ion flow from beam plasma generated while transporting the beam through forevacuum pressure area. The study demonstrates the possibility to control depth and form of milling by changing modes of electron beam treatment. Combined use of electron beam and automated system for beam deflection and sweep makes possible to perform dimensional processing, particularly cutting and milling with complex trajectory. Milling rates were experimentally found depending on treatment time and mode. The suggested method of silica glass treatment represents an alternative for traditional treatment methods.https://doi.org/10.1051/matecconf/201814303006
collection DOAJ
language English
format Article
sources DOAJ
author Zenin Aleksey
Klimov Aleksandr
Bakeev Ilya
spellingShingle Zenin Aleksey
Klimov Aleksandr
Bakeev Ilya
Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass
MATEC Web of Conferences
author_facet Zenin Aleksey
Klimov Aleksandr
Bakeev Ilya
author_sort Zenin Aleksey
title Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass
title_short Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass
title_full Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass
title_fullStr Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass
title_full_unstemmed Narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass
title_sort narrow-aperture electron beam in the forevacuum pressure range as a tool for dimensional processing of silica glass
publisher EDP Sciences
series MATEC Web of Conferences
issn 2261-236X
publishDate 2018-01-01
description The paper gives overview of the results of using narrow-aperture electron beam generated by a forevacuum plasma electron source as a tool for treatment of electrically non-conductive materials, such as technical glass. Effectiveness of electron beam treatment of non-conductive materials is caused by almost complete neutralization of target charge on the treated surface. Charge neutralization occurs due to ion flow from beam plasma generated while transporting the beam through forevacuum pressure area. The study demonstrates the possibility to control depth and form of milling by changing modes of electron beam treatment. Combined use of electron beam and automated system for beam deflection and sweep makes possible to perform dimensional processing, particularly cutting and milling with complex trajectory. Milling rates were experimentally found depending on treatment time and mode. The suggested method of silica glass treatment represents an alternative for traditional treatment methods.
url https://doi.org/10.1051/matecconf/201814303006
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AT klimovaleksandr narrowapertureelectronbeamintheforevacuumpressurerangeasatoolfordimensionalprocessingofsilicaglass
AT bakeevilya narrowapertureelectronbeamintheforevacuumpressurerangeasatoolfordimensionalprocessingofsilicaglass
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