Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin
Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost. Compared with Sn-Bi solder alloy and Sn-Pb solder alloy, the strength and plasticity of Sn-Bi solder are not enough, due to...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-10-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/8/11/2024 |