A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties

The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstripli...

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Main Authors:	Sunit Rane, Vijaya Puri
Format:	Article
Language:	English
Published:	Hindawi Limited 2000-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.23.163

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spelling	doaj-9f5ef5ef913c430295bf9c642f8af3b82020-11-24T22:34:56ZengHindawi LimitedActive and Passive Electronic Components0882-75161563-50312000-01-0123316317310.1155/APEC.23.163A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline PropertiesSunit Rane0Vijaya Puri1Thick and Thin Film Device Lab, Department of Physics, Shivaji University, Kolhapur 416004, IndiaThick and Thin Film Device Lab, Department of Physics, Shivaji University, Kolhapur 416004, IndiaThe transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstriplines on alumina substrate. These microstriplines were compared with the microstriplines made from ESL (USA) pastes and also Cu thin film circuits. The effect of line width, composition and firing temperature on the thick film microstriplines was investigated. The transmittance of all the indigenously prepared Ag thick film paste compared well with microstriplines prepared with ESL pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more suitable than conventional 25-mil line width if thick films are used for metallization upto 18.0 GHz.http://dx.doi.org/10.1155/APEC.23.163
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Sunit Rane Vijaya Puri
spellingShingle	Sunit Rane Vijaya Puri A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties Active and Passive Electronic Components
author_facet	Sunit Rane Vijaya Puri
author_sort	Sunit Rane
title	A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties
title_short	A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties
title_full	A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties
title_fullStr	A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties
title_full_unstemmed	A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties
title_sort	study on effect of line width, composition and firing temperature on the microstripline properties
publisher	Hindawi Limited
series	Active and Passive Electronic Components
issn	0882-7516 1563-5031
publishDate	2000-01-01
description	The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstriplines on alumina substrate. These microstriplines were compared with the microstriplines made from ESL (USA) pastes and also Cu thin film circuits. The effect of line width, composition and firing temperature on the thick film microstriplines was investigated. The transmittance of all the indigenously prepared Ag thick film paste compared well with microstriplines prepared with ESL pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more suitable than conventional 25-mil line width if thick films are used for metallization upto 18.0 GHz.
url	http://dx.doi.org/10.1155/APEC.23.163
work_keys_str_mv	AT sunitrane astudyoneffectoflinewidthcompositionandfiringtemperatureonthemicrostriplineproperties AT vijayapuri astudyoneffectoflinewidthcompositionandfiringtemperatureonthemicrostriplineproperties AT sunitrane studyoneffectoflinewidthcompositionandfiringtemperatureonthemicrostriplineproperties AT vijayapuri studyoneffectoflinewidthcompositionandfiringtemperatureonthemicrostriplineproperties
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A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties

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