A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties
The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstripli...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2000-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.23.163 |
| Summary: | The transmittance and reflectance of microstriplines of different widths, fabricated
by thick film and thin film technology are studied in the X and Ku band (8–18 GHz).
The fritless thick film Ag pastes with different binder composition was formulated indigenously
and screen-printed the microstriplines on alumina substrate. These microstriplines
were compared with the microstriplines made from ESL (USA) pastes and also
Cu thin film circuits. The effect of line width, composition and firing temperature on the
thick film microstriplines was investigated. The transmittance of all the indigenously
prepared Ag thick film paste compared well with microstriplines prepared with ESL
pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results
indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more
suitable than conventional 25-mil line width if thick films are used for metallization upto
18.0 GHz. |
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| ISSN: | 0882-7516 1563-5031 |