Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits

Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits

Bibliographic Details
Main Author:	Ch. Zimmer
Format:	Article
Language:	English
Published:	Hindawi Limited 1983-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.10.209

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