BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS

Copper based materials are widely used in industrial and marine applications due to good mechanical properties and high corrosion resistant behavior. But the corrosion immunity varies for the variation of environmental factors. Moreover, alloying elements can have role on corrosion behavior, especia...

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Main Authors: Muzibur M. RAHMAN, Reaz S. AHMED, Salim M. KAISER
Format: Article
Language:English
Published: Politehnium Publishing House 2020-12-01
Series:European Journal of Materials Science and Engineering
Subjects:
Online Access:https://ejmse.ro/articles/05_04_03_EJMSE-20-110.pdf
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spelling doaj-9c539cc4987145a6a909ca3d72d8b2882020-12-29T15:52:03ZengPolitehnium Publishing HouseEuropean Journal of Materials Science and Engineering2537-43382537-43462020-12-015419921110.36868/ejmse.2020.05.04.199BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTSMuzibur M. RAHMAN0Reaz S. AHMED1Salim M. KAISER2Department of Naval Architecture & Marine Engineering, Military Institute of Science and Technology, Dhaka-1216, BangladeshDepartment of Mechanical Engineering, Bangladesh University of Engineering and Technology, Dhaka-1000, BangladeshDirectorate of Advisory, Extension and Research Services, Bangladesh University of Engineering and Technology, Dhaka-1000, BangladeshCopper based materials are widely used in industrial and marine applications due to good mechanical properties and high corrosion resistant behavior. But the corrosion immunity varies for the variation of environmental factors. Moreover, alloying elements can have role on corrosion behavior, especially if it occurs through inclusion of Sn-Pb solder for repair works and environmental effects due to ageing. The present paper is an attempt to characterize the corrosion immunity level of copper after inclusion of tiny SnPb-solder material and work hardening in pH varied fresh water environments from pH1 to pH13 using gravimetric analysis, conductivity investigation and micrograph observation using optical as well as field emission scanning electronic microscope. The result reveals that solder material inclusion has increased the corrosion rate by about 14% in 30 days immersion in pH varied environments.https://ejmse.ro/articles/05_04_03_EJMSE-20-110.pdfcorrosionwork hardeningsnpb-solder inclusioncopperph varied environment
collection DOAJ
language English
format Article
sources DOAJ
author Muzibur M. RAHMAN
Reaz S. AHMED
Salim M. KAISER
spellingShingle Muzibur M. RAHMAN
Reaz S. AHMED
Salim M. KAISER
BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS
European Journal of Materials Science and Engineering
corrosion
work hardening
snpb-solder inclusion
copper
ph varied environment
author_facet Muzibur M. RAHMAN
Reaz S. AHMED
Salim M. KAISER
author_sort Muzibur M. RAHMAN
title BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS
title_short BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS
title_full BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS
title_fullStr BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS
title_full_unstemmed BEHAVIOR OF WORK HARDENED SnPb-SOLDER AFFECTED COPPER ON CORROSION RESISTANCE IN pH VARIED ENVIRONMENTS
title_sort behavior of work hardened snpb-solder affected copper on corrosion resistance in ph varied environments
publisher Politehnium Publishing House
series European Journal of Materials Science and Engineering
issn 2537-4338
2537-4346
publishDate 2020-12-01
description Copper based materials are widely used in industrial and marine applications due to good mechanical properties and high corrosion resistant behavior. But the corrosion immunity varies for the variation of environmental factors. Moreover, alloying elements can have role on corrosion behavior, especially if it occurs through inclusion of Sn-Pb solder for repair works and environmental effects due to ageing. The present paper is an attempt to characterize the corrosion immunity level of copper after inclusion of tiny SnPb-solder material and work hardening in pH varied fresh water environments from pH1 to pH13 using gravimetric analysis, conductivity investigation and micrograph observation using optical as well as field emission scanning electronic microscope. The result reveals that solder material inclusion has increased the corrosion rate by about 14% in 30 days immersion in pH varied environments.
topic corrosion
work hardening
snpb-solder inclusion
copper
ph varied environment
url https://ejmse.ro/articles/05_04_03_EJMSE-20-110.pdf
work_keys_str_mv AT muziburmrahman behaviorofworkhardenedsnpbsolderaffectedcopperoncorrosionresistanceinphvariedenvironments
AT reazsahmed behaviorofworkhardenedsnpbsolderaffectedcopperoncorrosionresistanceinphvariedenvironments
AT salimmkaiser behaviorofworkhardenedsnpbsolderaffectedcopperoncorrosionresistanceinphvariedenvironments
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