Multicharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistors
We report on our multi–pronged approach to understand the structural and electrical properties of an InAl(Ga)N(33nm barrier)/Al(Ga)N(1nm interlayer)/GaN(3μm)/ AlN(100nm)/Al2O3 high electron mobility transistor (HEMT) heterostructure grown by metal organic vapor phase epitaxy (MOVPE). In...
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doaj-9a46295aa3e341238236b26840a9191f2020-11-25T01:58:32ZengAIP Publishing LLCAIP Advances2158-32262014-12-01412127101127101-1310.1063/1.4903227001412ADVMulticharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistorsG. Naresh-Kumar0A. Vilalta-Clemente1S. Pandey2D. Skuridina3H. Behmenburg4P. Gamarra5G. Patriarche6I. Vickridge7M. A. di Forte-Poisson8P. Vogt9M. Kneissl10M. Morales11P. Ruterana12A. Cavallini13D. Cavalcoli14C. Giesen15M. Heuken16C. Trager-Cowan17Dept of Physics, SUPA, University of Strathclyde, Glasgow G4 0NG, UKCIMAP UMR 6252 CNRS-ENSICAEN-CEA-UCBN 14050 Caen Cedex, FranceDipartimento di Fisica Astronomia, Università di Bologna, 40127 Bologna, ItalyInstitute of Solid State Physics, Technical University Berlin, 10623 Berlin, GermanyAIXTRON SE, Kaiserstr. 98, 52134 Herzogenrath, GermanyThales Research and Technology, III-V Lab, 91460 Marcoussis, FranceLPN, Route de Nozay, 91460 Marcoussis, FranceInstitut des NanoSciences, Université Pierre et Marie Curie, 75015 Paris, FranceThales Research and Technology, III-V Lab, 91460 Marcoussis, FranceInstitute of Solid State Physics, Technical University Berlin, 10623 Berlin, GermanyInstitute of Solid State Physics, Technical University Berlin, 10623 Berlin, GermanyCIMAP UMR 6252 CNRS-ENSICAEN-CEA-UCBN 14050 Caen Cedex, FranceCIMAP UMR 6252 CNRS-ENSICAEN-CEA-UCBN 14050 Caen Cedex, FranceDipartimento di Fisica Astronomia, Università di Bologna, 40127 Bologna, ItalyDipartimento di Fisica Astronomia, Università di Bologna, 40127 Bologna, ItalyAIXTRON SE, Kaiserstr. 98, 52134 Herzogenrath, GermanyAIXTRON SE, Kaiserstr. 98, 52134 Herzogenrath, GermanyDept of Physics, SUPA, University of Strathclyde, Glasgow G4 0NG, UK We report on our multi–pronged approach to understand the structural and electrical properties of an InAl(Ga)N(33nm barrier)/Al(Ga)N(1nm interlayer)/GaN(3μm)/ AlN(100nm)/Al2O3 high electron mobility transistor (HEMT) heterostructure grown by metal organic vapor phase epitaxy (MOVPE). In particular we reveal and discuss the role of unintentional Ga incorporation in the barrier and also in the interlayer. The observation of unintentional Ga incorporation by using energy dispersive X–ray spectroscopy analysis in a scanning transmission electron microscope is supported with results obtained for samples with a range of AlN interlayer thicknesses grown under both the showerhead as well as the horizontal type MOVPE reactors. Poisson–Schrödinger simulations show that for high Ga incorporation in the Al(Ga)N interlayer, an additional triangular well with very small depth may be exhibited in parallel to the main 2–DEG channel. The presence of this additional channel may cause parasitic conduction and severe issues in device characteristics and processing. Producing a HEMT structure with InAlGaN as the barrier and AlGaN as the interlayer with appropriate alloy composition may be a possible route to optimization, as it might be difficult to avoid Ga incorporation while continuously depositing the layers using the MOVPE growth method. Our present work shows the necessity of a multicharacterization approach to correlate structural and electrical properties to understand device structures and their performance. http://dx.doi.org/10.1063/1.4903227 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
G. Naresh-Kumar A. Vilalta-Clemente S. Pandey D. Skuridina H. Behmenburg P. Gamarra G. Patriarche I. Vickridge M. A. di Forte-Poisson P. Vogt M. Kneissl M. Morales P. Ruterana A. Cavallini D. Cavalcoli C. Giesen M. Heuken C. Trager-Cowan |
spellingShingle |
G. Naresh-Kumar A. Vilalta-Clemente S. Pandey D. Skuridina H. Behmenburg P. Gamarra G. Patriarche I. Vickridge M. A. di Forte-Poisson P. Vogt M. Kneissl M. Morales P. Ruterana A. Cavallini D. Cavalcoli C. Giesen M. Heuken C. Trager-Cowan Multicharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistors AIP Advances |
author_facet |
G. Naresh-Kumar A. Vilalta-Clemente S. Pandey D. Skuridina H. Behmenburg P. Gamarra G. Patriarche I. Vickridge M. A. di Forte-Poisson P. Vogt M. Kneissl M. Morales P. Ruterana A. Cavallini D. Cavalcoli C. Giesen M. Heuken C. Trager-Cowan |
author_sort |
G. Naresh-Kumar |
title |
Multicharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistors |
title_short |
Multicharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistors |
title_full |
Multicharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistors |
title_fullStr |
Multicharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistors |
title_full_unstemmed |
Multicharacterization approach for studying InAl(Ga)N/Al(Ga)N/GaN heterostructures for high electron mobility transistors |
title_sort |
multicharacterization approach for studying inal(ga)n/al(ga)n/gan heterostructures for high electron mobility transistors |
publisher |
AIP Publishing LLC |
series |
AIP Advances |
issn |
2158-3226 |
publishDate |
2014-12-01 |
description |
We report on our multi–pronged approach to understand the structural and electrical properties of an InAl(Ga)N(33nm barrier)/Al(Ga)N(1nm interlayer)/GaN(3μm)/ AlN(100nm)/Al2O3 high electron mobility transistor (HEMT) heterostructure grown by metal organic vapor phase epitaxy (MOVPE). In particular we reveal and discuss the role of unintentional Ga incorporation in the barrier and also in the interlayer. The observation of unintentional Ga incorporation by using energy dispersive X–ray spectroscopy analysis in a scanning transmission electron microscope is supported with results obtained for samples with a range of AlN interlayer thicknesses grown under both the showerhead as well as the horizontal type MOVPE reactors. Poisson–Schrödinger simulations show that for high Ga incorporation in the Al(Ga)N interlayer, an additional triangular well with very small depth may be exhibited in parallel to the main 2–DEG channel. The presence of this additional channel may cause parasitic conduction and severe issues in device characteristics and processing. Producing a HEMT structure with InAlGaN as the barrier and AlGaN as the interlayer with appropriate alloy composition may be a possible route to optimization, as it might be difficult to avoid Ga incorporation while continuously depositing the layers using the MOVPE growth method. Our present work shows the necessity of a multicharacterization approach to correlate structural and electrical properties to understand device structures and their performance.
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url |
http://dx.doi.org/10.1063/1.4903227 |
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