Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging

• Main Authors: Ping Zhang, Rongzhuan Wei, Jianhua Zeng, Miao Cai, Jing Xiao, Daoguo Yang
• Format: Article
• Language: English
• Published: Hindawi Limited 2016-01-01
• Series: Journal of Nanomaterials
• Online Access: http://dx.doi.org/10.1155/2016/8681513

This paper describes the preparation of low-temperature sintered nanosilver paste with inverse microemulsion method with Span-80/Triton X-100 as the mixed-surfactant and analyzes the influence of different sintering parameters (temperature, pressure) on the shear properties of low-temperature sintering of nanosilver. Experimental results show that the shear strength of the low-temperature sintering of nanosilver increases as the temperature and pressure increase. But there are many pores and relative fewer cracks on the sintering layer after low-temperature sintered. The test thermal resistance of low-temperature sintered nanosilver paste is 0.795 K/W which is greater than SAC305 weld layer with a T3ster thermal analyzer. The adhesive performance and the heat dispersion of low-temperature sintered nanosilver paste need to be further researched and improved.