Mechanical characterization of soft substrates for wearable and washable electronic systems
Integration of complex electronics into our everyday outfit is a key challenge for the tomorrow-wearable technologies. When performing data processing and communications, these circuits are an essential part of sensing and actuating smart systems. The choice of an appropriate electronic substrate is...
Main Authors: | S. de Mulatier, M. Ramuz, D. Coulon, S. Blayac, R. Delattre |
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Format: | Article |
Language: | English |
Published: |
AIP Publishing LLC
2019-03-01
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Series: | APL Materials |
Online Access: | http://dx.doi.org/10.1063/1.5063671 |
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