Analysis of Welding Pad for Terahertz Hybrid Integrated Mixer

Analysis of Welding Pad for Terahertz Hybrid Integrated Mixer

In this paper, the influence of the silver glue on circuit performance and the reasons for its formation are analyzed in a terahertz hybrid integrated mixer. A validation analysis was carried out in the 600 - 700 GHz band with the aid of simulation software. Then a terahertz hybrid integrated mixing...

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Bibliographic Details
Main Authors: Dongfeng Ji, Bo Zhang, Jiale Wang, Yilin Yang, Yang Liu, Yiwei Wang, Zhongqian Niu, Yong Fan, Xiaodong Chen
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Terahertz
hybrid integrated
harmonics mixer
solid state
Online Access:https://ieeexplore.ieee.org/document/8963909/

Internet

https://ieeexplore.ieee.org/document/8963909/

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