Mathematical model predicts the elastic behavior of composite materials

• Main Authors: Zoroastro de Miranda Boari, Waldemar Alfredo Monteiro, Carlos Alexandre de Jesus Miranda
• Format: Article
• Language: English
• Published: Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol) 2005-03-01
• Series: Materials Research
• Subjects: metal; particle; modelling
• Online Access: http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392005000100017

Several studies have found that the non-uniform distribution of reinforcing elements in a composite material can markedly influence its characteristics of elastic and plastic deformation and that a composite's overall response is influenced by the physical and geometrical properties of its reinforcing phases. The finite element method, Eshelby's method and dislocation mechanisms are usually employed in formulating a composite's constitutive response. This paper discusses a composite material containing SiC particles in an aluminum matrix. The purpose of this study was to find the correlation between a composite material's particle distribution and its resistance, and to come up with a mathematical model to predict the material's elastic behavior. The proposed formulation was applied to establish the thermal stress field in the aluminum-SiC composite resulting from its fabrication process, whereby the mixture is prepared at 600 °C and the composite material is used at room temperature. The analytical results, which are presented as stress probabilities, were obtained from the mathematical model proposed herein. These results were compared with the numerical ones obtained by the FEM method. A comparison of the results of the two methods, analytical and numerical, reveals very similar average thermal stress values. It is also shown that Maxwell-Boltzmann's distribution law can be applied to identify the correlation between the material's particle distribution and its resistance, using Eshelby's thermal stresses.