Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

This article reviews current research and development as well as future opportunities for packaging and antenna integration technologies for silicon-based millimeter-wave phased arrays in emerging communication applications. Implementations of state-of-the-art silicon-based phased arrays below 100 G...

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Bibliographic Details
Main Authors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Journal of Microwaves
Subjects:
5G
cellular communication
mobile communication
antenna arrays
electronic packaging
thermal management
Online Access:https://ieeexplore.ieee.org/document/9318734/

Internet

https://ieeexplore.ieee.org/document/9318734/

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