Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design

Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design

This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strategy improves the luminous efficiency by 7.69% and 18...

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Main Authors: Nan Jiang, Jun Zou, Changran Zheng, Mingming Shi, Wenbo Li, Yiming Liu, Bin Guo, Jerry Liu, Herry Liu, Xavier Yin
Format: Article
Language:English
Published: MDPI AG 2018-10-01
Series:Applied Sciences
Subjects:
optical design and fabrication
chip-scale package
light-emitting diode
optical devices
Online Access:http://www.mdpi.com/2076-3417/8/10/1940
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record_format Article
spelling doaj-9786e623f0684b51b00d896136ea56f92020-11-25T01:32:30ZengMDPI AGApplied Sciences2076-34172018-10-01810194010.3390/app8101940app8101940Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package DesignNan Jiang0Jun Zou1Changran Zheng2Mingming Shi3Wenbo Li4Yiming Liu5Bin Guo6Jerry Liu7Herry Liu8Xavier Yin9School of Meterial Scince and Engineering, Shanghai Institute of Technoligy, Shanghai 201418, ChinaSchool of Meterial Scince and Engineering, Shanghai Institute of Technoligy, Shanghai 201418, ChinaSchool of Material Science and Engineering, Changchun University of Science and Technology, Changchun 130022, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai 201418, ChinaZhejiang Emitting Optoelectronic Technology Company, Zhejiang 310000, ChinaSchool of Meterial Scince and Engineering, Shanghai Institute of Technoligy, Shanghai 201418, ChinaSchool of Material Science and Engineering, Changchun University of Science and Technology, Changchun 130022, ChinaTecore Synchem, INC., Tianjin 300451, ChinaTecore Synchem, INC., Tianjin 300451, ChinaTecore Synchem, INC., Tianjin 300451, ChinaThis article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strategy improves the luminous efficiency by 7.69% and 18.97% than the traditional dispensing packaged LED filament when the current is at 30 mA and 210 mA, respectively, and reduces the use of red phosphors and green phosphors by 66.7% and 26.2%, respectively. With the increase of the current, the luminous efficiency variations of the stacked-packaged filament are lower than that of the traditional dispensing packaged filament. Moreover, the color temperature of the filament is no longer determined by the calculation of the ratio of various phosphors. The stacked structure and the segmented design can help us to adjust the specified color temperature quickly by changing the proportion and position of the blue chips and the red CSP LEDs.http://www.mdpi.com/2076-3417/8/10/1940optical design and fabricationchip-scale packagelight-emitting diodeoptical devices
collection DOAJ
language English
format Article
sources DOAJ
author Nan Jiang
Jun Zou
Changran Zheng
Mingming Shi
Wenbo Li
Yiming Liu
Bin Guo
Jerry Liu
Herry Liu
Xavier Yin
spellingShingle Nan Jiang
Jun Zou
Changran Zheng
Mingming Shi
Wenbo Li
Yiming Liu
Bin Guo
Jerry Liu
Herry Liu
Xavier Yin
Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
Applied Sciences
optical design and fabrication
chip-scale package
light-emitting diode
optical devices
author_facet Nan Jiang
Jun Zou
Changran Zheng
Mingming Shi
Wenbo Li
Yiming Liu
Bin Guo
Jerry Liu
Herry Liu
Xavier Yin
author_sort Nan Jiang
title Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
title_short Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
title_full Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
title_fullStr Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
title_full_unstemmed Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
title_sort fabrication process and performance analysis of csp led filaments with a stacked package design
publisher MDPI AG
series Applied Sciences
issn 2076-3417
publishDate 2018-10-01
description This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strategy improves the luminous efficiency by 7.69% and 18.97% than the traditional dispensing packaged LED filament when the current is at 30 mA and 210 mA, respectively, and reduces the use of red phosphors and green phosphors by 66.7% and 26.2%, respectively. With the increase of the current, the luminous efficiency variations of the stacked-packaged filament are lower than that of the traditional dispensing packaged filament. Moreover, the color temperature of the filament is no longer determined by the calculation of the ratio of various phosphors. The stacked structure and the segmented design can help us to adjust the specified color temperature quickly by changing the proportion and position of the blue chips and the red CSP LEDs.
topic optical design and fabrication
chip-scale package
light-emitting diode
optical devices
url http://www.mdpi.com/2076-3417/8/10/1940
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