Co-Precipitation, Strength and Electrical Resistivity of Cu–26 wt % Ag–0.1 wt % Fe Alloy

• Main Authors: Rui Li, Engang Wang, Xiaowei Zuo
• Format: Article
• Language: English
• Published: MDPI AG 2017-12-01
• Series: Materials
• Subjects: Cu–Ag alloy; Fe addition; co-precipitation; precipitation kinetics; hardness; electrical resistivity
• Online Access: https://www.mdpi.com/1996-1944/10/12/1383

Both a Cu–26 wt % Ag (Fe-free) alloy and Cu–26 wt % Ag–0.1 wt % Fe (Fe-doping) alloy were subjected to different heat treatments. We studied the precipitation kinetics of Ag and Cu, microstructure evolution, magnetization, hardness, strength, and electrical resistivity of the two alloys. Fe addition was incapable of changing the precipitation kinetics of Ag and Cu; however, it decreased the size and spacing of rod-shaped Ag precipitates within a Cu matrix, because Fe might affect the elastic strain field and diffusion field, suppressing the nucleation of Ag precipitates. Magnetization curves showed that γ-Fe precipitates were precipitated out of the Cu matrix, along with Ag precipitates in Fe-doping alloy after heat treatments. The yield strength of the Fe-doping alloy was higher than that of the Fe-free alloy, and the maximum increment was about 41.3%. The electrical conductivity in the aged Fe-doping alloy was up to about 67% IACS (International Annealed Copper Standard). Hardness, strength, and electrical resistivity were intensively discussed, based on the microstructural characterization and solute contributions of both alloys. Our results demonstrated that an increasing fraction of nanoscale γ-Fe precipitates and decreasing spacing between Ag precipitates resulted in the increasing strength of the Fe-doping alloy.