Research on the Shape Precison of the Micro-groove in the Silicon under Diamond Fly-cutting

• Main Authors: Yan Yanyan, Yang Chengyun, Wang Runxing
• Format: Article
• Language: English
• Published: EDP Sciences 2016-01-01
• Series: MATEC Web of Conferences
• Online Access: http://dx.doi.org/10.1051/matecconf/20166703023

Based on the mechanical physical characteristics of the silicon wafers and the superior processing character of the diamond fly-cutting, the diamond fly-cutting was applied to the machining of the microgroove in the silicon, and the effect of the processing parameters on the machining shape precision of the microgroove arrays in the silicon was mainly studied. Firstly, the cutting model of the microgroove in cross section under the diamond fly-cutting was established and the theoretical curvature radius of the microgroove was obtained. Secondly, the shape precision of the microgroove is deduced. Finally, the processing experiment of the microgroove in the silicon was carried out. The experimental results reveal that the higher spindle speed n and the smaller cutting feed f are beneficial to machine the better microgroove in the silicon, but it is important to choose the appropriate cutting depth to machine the better microgroove in the silicon.