Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bonding

Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bonding

We produced SnCu interconnects by self-propagated exothermic reactions using AlNi NanoFoil at ambient conditions, through the instantaneous localised heat across the interfaces between Sn electroplated Cu substrates. This technique presents a great potential for electronics integration with minima...

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Bibliographic Details
Main Authors:	Wenbo Zhu, Xiaoting Wang, Changqing Liu, Zhaoxia Zhou, Fengshun Wu
Format:	Article
Language:	English
Published:	Elsevier 2019-07-01
Series:	Materials & Design
Online Access:	http://www.sciencedirect.com/science/article/pii/S0264127519302187

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