Dynamic anti-plane behavior for a semi-infinite piezoelectric medium with a locally debonded cylindrical inclusion near the surface

• Main Authors: Ming Zhao, Tian-shu Song, Ni An, Gangling Hou
• Format: Article
• Language: English
• Published: AIP Publishing LLC 2020-07-01
• Series: AIP Advances
• Online Access: http://dx.doi.org/10.1063/5.0015186

The problem of dynamically debonded cylindrical inclusion near the interface of semi-infinite piezoelectric materials was theoretically investigated. The effects of different geometric and physical parameters on the dynamic stress intensity factor (DSIF) of the crack tip are discussed. The theoretical expressions for the crack (debonding) DSIF were obtained using methods that included Green’s function, the complex variable function, and multipolar coordinates, and the numerical results showed that the dynamic characteristics of the debonded structure were more obvious under conditions of low frequency and large piezoelectric characteristic parameters. In addition, the period of the DSIF at the crack tip became shorter as the incident wave number increased. There are, therefore, important theoretical and engineering considerations for the dynamic analysis of piezoelectric materials with debonded cylindrical inclusion.