Numerical Assessment of Heat Transfer and Entropy Generation of a Porous Metal Heat Sink for Electronic Cooling Applications
In the present study, the thermal performance of an electronic equipment cooling system is investigated. The heat sink used in the current cooling system consists of a porous channel with a rectangular cross-section that is assumed to be connected directly to the hot surface of an electronic device....
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-07-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/13/15/3851 |